Products Suppliers Sign in Register

ZSUN CHIPS CO., LTD

One-stop Electronic Components Supply Platform.

Manufacturer from China
Verified Supplier
2 Years
Home Products Catalog Company Profile Quality Control Contact Us Request a Quota
English
Home / Products / Thermal Interface Materials / Filler Gap Thermal Pad Thermal Conductivity Silicone Laird Tflex HD700 /

show pictures

Product Categories

Power Inductors

 [36]

Thermal Interface Materials

 [12]

FPGA IC

 [6]

Board to Board Connectors

 [14]

IC Chips

 [494]

Common Mode Chokes

 [38]

Ferrite Core Ring

 [6]

FPC Connectors

 [10]

USB Connectors

 [9]

EMC Components

 [13]

Electronic Components Connectors

 [23]

EMC Materials

 [12]

EMI EMC Testing

 [6]
Contact Now
ZSUN CHIPS CO., LTD
Visit Website
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrsRose Luo
View Contact Details
Contact Now

Filler Gap Thermal Pad Thermal Conductivity Silicone Laird Tflex HD700
Filler Gap Thermal Pad Thermal Conductivity Silicone Laird Tflex HD700
  • Filler Gap Thermal Pad Thermal Conductivity Silicone Laird Tflex HD700
  • Filler Gap Thermal Pad Thermal Conductivity Silicone Laird Tflex HD700
Products Detailed
Tflex HD700 Thermal Pad Gap Filler Silicone Laird Thermal Conductivity 5.0 W/Mk Product Description Tflex™ HD700 thermal gap filler combines 5 W/mK ...
View Products Detailed →

Home Products Suppliers About Us Contact Us Help Site Map 公司介绍 联系我们

Français Русский язык Español 日本語 Português

China Hot Products: A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | 0~9

Copyright © 2009-2025 Everychina.com. All rights reserved. 京ICP备09074326号-4