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ZSUN CHIPS CO., LTD

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2 Years
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Home / Products / Thermal Interface Materials / High Thermally Conductive Interface Pads Gap Filler Thermal Pad Electronics /

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Product Categories

Power Inductors

 [36]

Thermal Interface Materials

 [12]

FPGA IC

 [6]

Board to Board Connectors

 [14]

IC Chips

 [494]

Common Mode Chokes

 [38]

Ferrite Core Ring

 [6]

FPC Connectors

 [10]

USB Connectors

 [9]

EMC Components

 [13]

Electronic Components Connectors

 [23]

EMC Materials

 [12]

EMI EMC Testing

 [6]
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ZSUN CHIPS CO., LTD
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City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrsRose Luo
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High Thermally Conductive Interface Pads Gap Filler Thermal Pad Electronics
High Thermally Conductive Interface Pads Gap Filler Thermal Pad Electronics
  • High Thermally Conductive Interface Pads Gap Filler Thermal Pad Electronics
  • High Thermally Conductive Interface Pads Gap Filler Thermal Pad Electronics
Products Detailed
High Thermal Conductivity Pad Gap Filler Silicone Tflex HD90000 Laird Thermal Conductivity 7.5 W/Mk Product Description Tflex HD90000 combines 7.5 W...
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